How To Test Printed Circuit Board Assembly with a Flexible Sensor

In this Video , Darryl talks about cracks in the PCBs and shows how Micro-Measurements G1350A strain gage sensor is used when testing components, sub-assemblies, printed circuit boards, Ball Grid Array (BGA) surface mount packaging and finished products. Who should use foil strain gage sensors: Test-fixture vendors, Component suppliers, Contract manufacturers (EMS), PCB assemblers. Main problems: PCB failure due of over-flexure during various assembly and test processes, minor cracks and last but not least field returns.

C5K Series 3-Element Rosette Gages:

https://micro-measurements.com/rectangular-rosette-patterns